Cindy Petronis Email
Sr. Product Engineer . FlipChip International
Phoenix, AZ
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FlipChip International in Phoenix, Arizona offers complete flip chip solutions including R&D, prototype development and high volume production for IC manufacturers. As the flip chip technology leader, we deliver proven bumping technology and wafer level packaging (WLP) for applications requiring higher performance, reduced form-factor and greater density than those obtainable through traditional surface mount technologies.FlipChip International Address
3701 E UniversityPhoenix, AZ
United States