FlipChip International Revenue and Competitors
Estimated Revenue & Valuation
- FlipChip International's estimated annual revenue is currently $25.6M per year.
- FlipChip International's estimated revenue per employee is $304,464
Employee Data
- FlipChip International has 84 Employees.
- FlipChip International grew their employee count by -1% last year.
FlipChip International's People
| Name | Title | Email/Phone |
|---|---|---|
1 | Director Quality, Reliability and Supply management | Reveal Email/Phone |
2 | R&D and Reliability Engineering Manager | Reveal Email/Phone |
3 | Human Resource Manager | Reveal Email/Phone |
4 | Process Engineer | Reveal Email/Phone |
5 | Inventory Control | Reveal Email/Phone |
6 | Planning & Logistics Mgr. | Reveal Email/Phone |
7 | Lead Process Tech/Process Technician | Reveal Email/Phone |
8 | Process Engineer | Reveal Email/Phone |
9 | Sr. Product Engineer | Reveal Email/Phone |
10 | Associate Process Engineer | Reveal Email/Phone |
FlipChip International Competitors & AlternativesAdd Company
| Competitor Name | Revenue | Number of Employees | Employee Growth | Total Funding | Valuation |
|---|---|---|---|---|---|
#1 | $7.1M | 36 | -18% | N/A | N/A |
What Is FlipChip International?
FlipChip International in Phoenix, Arizona offers complete flip chip solutions including R&D, prototype development and high volume production for IC manufacturers. As the flip chip technology leader, we deliver proven bumping technology and wafer level packaging (WLP) for applications requiring higher performance, reduced form-factor and greater density than those obtainable through traditional surface mount technologies.
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Total Funding
84
Number of Employees
$25.6M
Revenue (est)
-1%
Employee Growth %
N/A
Valuation
N/A
Accelerator
FlipChip International News
The global Semiconductor Advanced Packaging Market market study assesses ... ChipMOS TECHNOLOGIES, FlipChip International, HANA Micron,...
Flip Chip Bonder Market Projection By Key Players, Status, Growth, Revenue, SWOT Analysis Forecast 2030| Besi, ASM Pacific Technology, Shibaura. Global Flip...
Fan-Out Wafer-Level Packaging(FO WLP) · Fan-In Wafer-Level Packaging(FI WLP) · Flip Chip(FC) · 2.5D/3D.
Other Companies in Phoenix
| Company Name | Revenue | Number of Employees | Employee Growth | Total Funding |
|---|---|---|---|---|
#1 | $22.7M | 84 | -6% | N/A |
#2 | $22.7M | 84 | 40% | N/A |
#3 | $22.7M | 84 | 53% | N/A |
#4 | $12.2M | 84 | -2% | N/A |
#5 | $7.5M | 84 | -12% | N/A |