Argo Transdata Corp Revenue and Competitors

Founded in 1969 as a contract manufacturer, Argo has continually held a position at the forefront of circuit miniaturization technology. Our initial products were very high-density resistor networks for scientific research applications at universities and other research institutions. From these networks, thick and thin film ceramic hybrid circuit assemblies were a natural growth step. In the mid 1970s Argo helped pioneer a new technology called Chip On Board (COB) and various Multi Chip Module (MCM) designations. COB forms the initial basic step for Ball Grid Array (BGA) technology. As active Surface Mount components began to appear in the 1980's, we saw the manufacturing economies possible and developed the processes to capture this new technology. Equipment for solder paste screening, automatic component placement, reflow soldering and assembly cleaning was installed. We again helped pioneer the combining of all these technologies to produce circuit layouts designed for size/cost optimization. Argo is capable of producing circuits of virtually any size from placing a single die on a substrate to assembly of full 17 X 24 inch combination Surface Mount and Through Hole circuit boards. While most of our business is combination Surface Mount and Through Hole circuit boards, our special expertise is high and very high density (Surface Mount, COB and hybrid) component placement on ceramic and multi-layer PC boards. Argo has been involved in the design and manufacture of high quality miniaturized electronic circuits to general industry since 1975. Argo is well established in the industry and we've built our business on customer satisfaction. Our customers will be glad to substantiate our claims of quality products delivered on time. Call for a list of references.