The Soitec Group is a leading innovator and provider of the engineered substrate solutions that serve as the foundation for today's most advanced microelectronic products. The group leverages its proprietary Smart Cut technology to engineer new substrate solutions, such as SOI wafers, which became the first high-volume application for this proprietary technology. Since then, SOI has emerged as the "material platform of the future, enabling the production of higher performing, faster chips that consume less power." Today, Soitec produces more than 80% of the world's SOI wafers. Headquartered in Bernin, France, with two high-volume fabs on-site, Soitec has offices throughout the U.S., Japan, and Taiwan, and a new production site in the process of customers' qualification in Singapore. Two other divisions, Picogiga International (Les Ulis) and Tracit Technologies (Bernin), complete the Soitec Group. Picogiga focuses on delivering advanced substrates solutions, including III-V epiwafers and gallium nitride-based wafers, to the compound material world for the manufacture of high-frequency electronics and other optoelectronic devices. Tracit, on the other hand, focuses on thin-film layer transfer technologies, used to manufacture advanced substrates for power ICs and microsystems, as well as generic circuit transfer technology for applications such as image sensors and 3D integration.